With the increasing popularity and wide application of the third generation semiconductor devices, innovation has been brought to the industry. Based on its high-speed, small size, low loss, high power, high heat dissipation, high integration and other development directions, it is more and more widely used in consumer electronics and power electronics industries. Advanced packaging materials and reliability technologies are constantly developing and improving, and car silicon level devices are constantly getting on the train. At present, a whole industry chain from materials, devices, packaging, testing to applications has initially formed, but the overall technical level is still behind the world level, and it is urgent to break through materials The core key technologies and reliability, consistency and other engineering application issues in the links of wafer, packaging, testing, process and application, covering the new progress of the third generation semiconductor devices and packaging technology, advanced packaging materials and reliability for SiC/GaN power devices, SiC/GaN power device process, new packaging structural materials for devices, sintered silver interconnection technology, reliability testing of packaging materials, packaging heat management Thermal and mechanical reliability simulation equipment is used to understand various challenges of high-power power electronic devices and packaging, invite the advantageous forces in multiple fields of industry, university and research, well-known experts in the industry, and enterprise representatives to share special reports, discuss new progress, and promote the development of the third generation semiconductor devices and packaging technology.